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1. #TIMELINE 3D FOR IOS USER GUIDE UPDATE#
2. #TIMELINE 3D FOR IOS USER GUIDE MANUAL#
3. #TIMELINE 3D FOR IOS USER GUIDE FULL#
4. #TIMELINE 3D FOR IOS USER GUIDE FREE#

In addition, where a predefined ‘8-leg’ (8-spoke) thermal relief is defined in Xpedition, this will also be imported as a custom thermal relief. The Xpedition Importer supports importing custom thermal reliefs defined in an Xpedition™ board design. If required, you can also choose the minimal distance between the conductors by enabling the Min Distance checkbox and entering an appropriate value.

#TIMELINE 3D FOR IOS USER GUIDE MANUAL#

When thermal relief is manually defined for a pad or via, it will be denoted by the Manual option in the Properties panel and the Edit Polygon Connect Style dialog that is now accessed by clicking the link in the Thermal Relief field in the Properties panel. When adding, editing or removing connection points, they are presented as white crosshairs on the pad/via edge.Īn example of a simple pad with custom thermal relief defined After clicking the Edit Points button, you can use Ctrl+Click to graphically add a spoke at any point along the pad shape without invoking the command from the right-click menu.

To manually define thermal relief connection points, enable the Thermal Relief option in the pad/via properties, then use the commands in the Pad Actions/ Via Actions right-click menu or click the Edit Points button in the Properties panel. The points themselves can be edited and defined graphically directly within the PCB design space.

#TIMELINE 3D FOR IOS USER GUIDE FULL#

Manually-defined thermal relief connections are supported across all pad/via stack types (Simple, Top-Middle-Bottom, and Full Stack), with the ability to craft connection points as needed for different layers in Full Stack mode. You now have the ability to manually define thermal relief for pads and vias (both regular and custom shaped for pads) by precisely specifying the connection points where the spikes need to connect. You can use the Min Distance setting to control the spacing between each spike. In both modes, an Auto option has been added, which automatically adds a relief connection from the center of each pad/via edge. Thermal reliefs can be applied in one of two modes, either rules-driven (using the Polygon Connect Style design rule) or custom (at the individual pad/via level, configured using the Edit Polygon Connect Style dialog). This release brings you greater control over the way in which pads and vias connect to a polygon pour. This feature is in Open Beta and is available when the PCB.SectionView option is enabled in the Advanced Settings dialog. Select the View » Toggle Section View command, click the button on the Active Bar, or use the buttons of the Section View option on the Section View tab of the View Configuration panel to toggle the display between Edit, On and Off. The Section View functionality is available in the PCB editor's 3D layout mode ( View » 3D Layout Mode, shortcut 3). Using the Section View is helpful when it is required to reveal details within a PCB that might typically not be visible, for example, when smaller SMD components are placed under larger components or mechanical parts, which could make operations such as component movement and distance measuring difficult.

To provide better insight into the layout and structure of a complex PCB, the Section View functionality has been implemented for the PCB editor.

Release Notes for Altium Designer Version 23.5 PCB Design Improvements

#TIMELINE 3D FOR IOS USER GUIDE FREE#

Click the link below, fill out the form, and see for yourself why more engineers and designers choose Altium than any other product available!Īltium Designer Free Trial. That's right, you will have the ability to evaluate the full Altium Designer experience with no technical limitations with unfettered access to the world's finest PCB design product. If you like what you see but are not yet a customer, why not take Altium Designer for a test drive? By filling out a simple form, you can try Altium Designer for free with 15 days of access to the full software.

#TIMELINE 3D FOR IOS USER GUIDE UPDATE#

Along with delivering a range of improvements that develop and mature the existing technologies, each update also incorporates a large number of fixes and enhancements across the software based on feedback raised by customers through the AltiumLive Community's BugCrunch system, helping you continue to create cutting-edge electronics technology. This page details the improvements included in the initial release of Altium Designer 23, as well as those added in subsequent updates.